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Sam H. Y. Zou, Mian Tao, Jeffery C. C. Lo, S. W. Ricky Lee (2013) “Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup”, Proc. 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, 11-14 August, pp. 1212-1216. Steven D. L. Zhong, Sam H. Y. Zou, Jeffery C. C. Lo, S. W. Ricky Lee (2013) “Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup”, Proc. 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, 11-14 August, pp. 612-616. Lo, J. C. C., Liu, H., Lee, S. W. R., Guo, X., Zhao, H. (2013) “Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens,” Proc. 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Micro-Electronics & Micro-Systems (EuroSimE), Wroclaw, Poland, 15-17 April, P006. Liu, H., Lo, J. C. C., Lee, S. W. R., Zhao, H. (2013) “LED Wafer Level Packaging with a Hemispherical Waffle Pack Remote Phosphor Layer,” Proc. 13th International Conference on Electronics Packaging (ICEP), Osaka, Japan, 10-12 April, pp. 368-373.
Tao, M., Lee, S. W. R., Yuen, M. M. F., Zhang, G., Driel, W. van (2012) “Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips,”Proc. 35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November, P141. Jeffery C. C. LO, S. W. Ricky LEE, Rong ZHANG, Mei LI (2012) “Reverse Wire Bonding and Phosphor Printing for LED Wafer Level Packaging,”Proc. 62th Electronic Components and Technology Conference (ECTC), pp. 1814-1818. Huihua Liu, Rong Zhang, Jeffery C. C. Lo, S. W. Ricky Lee (2012) “LED Wafer Level Packaging with a Remote Phosphor Cap,”Proc. 14th International Conference on Electronics Materials and Packaging (EMAP), pp. 251-255. S. W. Ricky LEE, Rong ZHANG, K. CHEN, Jeffery C.C.LO (2012) “Emerging Trend for LED Wafer Level Packaging,” Frontiers of Optoelectronics, Vol. 5, Issue 2, pp. 119-126.
Rong Zhang, S. W. Ricky Lee (2012) “Moldless Encapsulation for LED Wafer Level Packaging using Integrated DRIE Trenches,” Microelectronics Reliability, Vol.52, Issue 5, pp. 922-932. Huishan ZHAO, S. W. Ricky Lee (2012) “Determination of Driving Current of RGB LEDs for White Light Illumination，”Proc. Conference on International Conference on Electronic Packaging Technology & High Density Packaging, pp. 1540-1545 Huishan Zhao, Changying Chen, S. W. Ricky Lee (2012) “Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED,” Proc. Conference on ICSJ2012 IEEE CPMT Symposium Japan EP211, pp. 11-13 Zhang, R., Lee, S. W. R., Xiao, D. G., Chen, H. (2011) “LED Packaging using Silicon Substrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection,” Proc. 61st Electronic Components & Technology Conference (ECTC), Orlando, FL, 31 May-3 June, pp. 1616-1621
Rong Zhang, S. W. Ricky Lee, David Guowei Xiao, Haiying Chen (2011)“LED Packaging using Silicon Substrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection,”Proc. 61st Electronic Components and Technology Conference (ECTC), May, pp. 1-6. Kewei Chen, Rong Zhang and S. W. Ricky Lee (2010)“Integration of Phosphor Printing and Encapsulant Dispensing Processes for Wafer Level LED Array Packaging,”Proc. 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August, pp. 1386-1392.(Best paper award) Rong Zhang, Shi-Wei Ricky Lee (2010)“Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging,”Proc. 12th International Conference on Electronic Materials and Packaging (EMAP), October, pp. 1-5. Ricky S. W. Lee, Jeffery C. C. Lo, Rong Zhang (2010)“Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate,”Proc. 7th China International Forum on Solid State Lighting, October, pp. 320-323.
S. W. Ricky Lee, Rong Zhang, Wai Lok Leung (2010)“Solid State Light Tube with Periodic Divisions of Lateral-Emitting LEDs,”Proc. 60th Electronic Components and Technology Conference (ECTC), June, pp. 673-678. S. W. Ricky Lee, Y. W. Tong, Y. S. Chan, J. C. C. Lo, R. Zhang (2009)“Process Development and Prototyping for the Assembly of LED Arrays on Flexible Printed Circuit Tape for General Solid State Lighting,”Proc. 59th Electronic Components and Technology Conference (ECTC), May, pp. 2137-2142. S. W. Ricky Lee, Y. W. Tong, Y. S. Chan, J. C. C. Lo, R. Zhang (2008)“Development of Surface Mount Compatible Reel-to-Reel Assembly Process of LED Arrays for Wide Area General Lighting,”Proc. 10th International Conference on Electronic Materials and Packaging (EMAP), October, pp. 255-258. Rong Zhang, Shi-Wei Ricky Lee (2008)“Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation,”Proc. 9th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT), July, pp. 1-6.
 
Rong Zhang, Shi-Wei Ricky Lee (2007)“Wafer Level Encapsulation Process for LED Array Packaging,”Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), November, pp. 1-8. S. W. Ricky LEE, C. H. LAU, S. P. CHAN, K. Y. MA, M. H. NG, Y. W. NG, K. H. LEE, Jeffery C. C. LO (2006)“Development and Prototyping of a HB-LED Array Module for Indoor Solid State Lighting,”Proc. Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, pp. 141-145. K. H. LEE, S. W. Ricky LEE (2006)“Process Development for Yellow Phosphor Coating on Blue Light Emitting Diodes (LEDs) for White Light Illumination,”Proc. 8th Electronics Packaging Technology Conference (EPTC), pp. 379-384.