Prof. Ricky Lee received his PhD degree in Aeronautics and Astronautics from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. Currently he is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) at HKUST for two and a half years. In 2010, he was appointed the founding Director of HKUST LED-FPD Technology R&D Center at Foshan. Prof. Lee’s research activities cover wafer level packaging and 3D IC integration, through silicon vias (TSV) and high density interconnects, LED packaging for solid state lighting, lead-free soldering and reliability analysis. His group has substantial publications in international journals/conference proceedings and received nine best/outstanding paper awards. He also co-authored three books and nine book chapters. Prof. Lee is Fellow of IEEE, ASME, Institute of Physics (UK), and the recipient of several society awards. He is IEEE CPMT Distinguished Lecturer and has been invited to give seminars/workshops/short courses around the world. In addition, Prof. Lee was elected the President of IEEE CPMT Society and is serving for the term of 2012-2013.