Thermal Simulation Software

Model : ANSYS Icepak

ICEPAK software is professional in thermal analysis for electronic devices; it can be used to do Thermal/Flow field simulations of component-level, board-level, or system-level.

Main functions:

1.       Model building function: predefined objects, different object shapes, object libraries and ECAD/IDF import

2.       Zoom-in function: Auto-delivery the calculation results from upper level to lower level (from component-level to board-level and then board-level to system-level)

3.       Meshing technology: Automatic non-conformal meshing, tetrahedron/hexahedron/mixed mesh generation, powerful mesh quality evaluation tool

4.       Parameterization and optimization design function: Do unified calculation under different operating conditions, structures, and statuses based on parametric control of variables. Achieve the best design proposal by automatic optimization of variables

5.       Physical models: Contact resistance, natural convection, forced convection, mixed convection, heat conduction, heat radiation, fluid-solid coupling, laminar flow, turbulent flow, steady state flow and non-steady state flow

6.       Solver attributes: Fluent solver, structured and unstructured grid solver

7.       Results visualization function: Contour and vector displays, cut planes, and iso-surfaces